Effects of Ti addition to Sn–Ag and Sn–Cu solders

Lead (Pb)-free solders for electronic packaging

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Agriculture, Materials Engineering, Materials Science +8

Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders

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Natural Sciences, Electrical Engineering, Materials Science +16

Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability

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Natural Sciences, Materials Engineering, Materials Science +14

Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu

Yi-Wun Wang, Yan‐Cheng Lin, Chun-Te Tu et al. · Journal of Alloys and Compounds · 2008 · 195 citations

Natural Sciences, Materials Engineering, Materials Science +9

Effects of Minor Additions of Zn on Interfacial Reactions of Sn-Ag-Cu and Sn-Cu Solders with Various Cu Substrates during Thermal Aging

Moon Gi Cho, Sung K. Kang, Da‐Yuan Shih et al. · Journal of Electronic Materials · 2007 · 138 citations

Natural Sciences, Materials Engineering, Materials Science +17