Moon Gi Cho

Effects of Minor Additions of Zn on Interfacial Reactions of Sn-Ag-Cu and Sn-Cu Solders with Various Cu Substrates during Thermal Aging

Moon Gi Cho, Sung K. Kang, Da‐Yuan Shih et al. · Journal of Electronic Materials · 2007 · 138 citations

Natural Sciences, Materials Engineering, Materials Science +17

The Crystal Orientation of β-Sn Grains in Sn-Ag and Sn-Cu Solders Affected by Their Interfacial Reactions with Cu and Ni(P) Under Bump Metallurgy

Sun-Kyoung Seo, Sung K. Kang, Moon Gi Cho et al. · Journal of Electronic Materials · 2009 · 59 citations

Engineering, Materials Engineering, Materials Science +17

Effects of Co Addition on Bulk Properties of Sn-3.5Ag Solder and Interfacial Reactions with Ni-P UBM

Dong Hoon Kim, Moon Gi Cho, Sun-Kyoung Seo et al. · Journal of Electronic Materials · 2008 · 43 citations

Natural Sciences, Materials Engineering, Materials Science +13

Enhancement of heterogeneous nucleation of β-Sn phases in Sn-rich solders by adding minor alloying elements with hexagonal closed packed structures

Moon Gi Cho, Hyun You Kim, Sun-Kyoung Seo et al. · Applied Physics Letters · 2009 · 43 citations

Natural Sciences, Materials Engineering, Materials Science +16

Wettability and interfacial reactions of Sn-based Pb-free solders with Cu–xZn alloy under bump metallurgies

Moon Gi Cho, Sun-Kyoung Seo, Hyuck Mo Lee · Journal of Alloys and Compounds · 2008 · 39 citations

Natural Sciences, Materials Engineering, Materials Science +17