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Effects of Minor Additions of Zn on Interfacial Reactions of Sn-Ag-Cu and Sn-Cu Solders with Various Cu Substrates during Thermal Aging

Materials EngineeringMaterials ScienceChemical EngineeringMinor AdditionsEngineeringCorrosionSurface ScienceMetallurgical InteractionMetallurgical ProcessElectronic PackagingThermal AgingMetallurgical SystemSn-cu SoldersCladding (Metalworking)MicrostructureMetal Processing