Optimal design toward enhancement of thermomechanical reliability of polyimide layers in a flip-chip-on-lead-frame dual flat no-leads package with copper pillar bumps

Leakage current mechanisms and leakage reduction techniques in deep-submicrometer CMOS circuits

Kaushik Roy, Subhas Chandra Mukhopadhyay, Hamid Mahmoodi · Proceedings of the IEEE · 2003 · 2.3K citations

Engineering, Computer Engineering, Electrical Engineering +17

Pb-free solders for flip-chip interconnects

D. R. Frear, Jihun Jang, J. K. Lin et al. · JOM · 2001 · 317 citations

Engineering, Electrical Engineering, Materials Engineering +14

Influence of interfacial intermetallic compound on fracture behavior of solder joints

Hwa-Teng Lee, Ming‐Hung Chen, Huei-Mei Jao et al. · Materials Science and Engineering A · 2003 · 242 citations

Engineering, Materials Engineering, Materials Science +16

Electromigration in ULSI interconnects

Cher Ming Tan, Arijit Roy · Materials Science and Engineering R Reports · 2007 · 238 citations

Engineering, Electrical Engineering, Materials Science +12

Model for BGA and CSP Reliability in Automotive Underhood Applications

Pradeep Lall, Md Nazmul Islam, Naveen K. Singh et al. · IEEE Transactions on Components and Packaging Technologies · 2004 · 137 citations

Engineering, Automotive Engineering, Materials Engineering +17