Wenguo Ning

Wafer-Level Package With Simultaneous TSV Connection and Cavity Hermetic Sealing by Solder Bonding for MEMS Device

Yuhan Cao, Wenguo Ning, Le Luo · IEEE Transactions on Electronics Packaging Manufacturing · 2009 · 43 citations

Engineering, Wafer-level Package, Solder Bonding +16

Stress evolution during thermal cycling of copper/polyimide layered structures

Chunsheng Zhu, Wenguo Ning, Gaowei Xu et al. · Materials Science in Semiconductor Processing · 2014 · 22 citations

Materials Science, Engineering, Stressstrain Analysis +4

Experimental identification of warpage origination during the wafer level packaging process

Chunsheng Zhu, Wenguo Ning, Heng Lee et al. · 2014 · 18 citations

Engineering, Mechanical Engineering, Wafer Scale Processing +19

Optimal design toward enhancement of thermomechanical reliability of polyimide layers in a flip-chip-on-lead-frame dual flat no-leads package with copper pillar bumps

Wenguo Ning, Chunsheng Zhu, Heng Li et al. · Materials Science in Semiconductor Processing · 2013 · 12 citations

FEA study of the evolution of wafer warpage during reflow process in WLP

Chunsheng Zhu, Wenguo Ning, Jiaotuo Ye et al. · 2012 · 12 citations

Engineering, Polymer Wlp, Mechanical Engineering +17