Yuhan Cao

Publications

Citations

H-Index

2009

Active since

Affiliations

Shanghai Institute of Microsystem and Information Technology(Current)

Yuhan Cao is an author at Shanghai Institute of Microsystem and Information Technology specializing in applied physics, advanced packaging, and electronic packaging.

Top concepts

EngineeringApplied PhysicsAdvanced PackagingElectronic PackagingCorrosionMicrostructureSolidificationMaterial ScienceMicroelectronicsMicrofabrication

Publications per year

2009–2009

Publications

Wafer-Level Package With Simultaneous TSV Connection and Cavity Hermetic Sealing by Solder Bonding for MEMS Device

Yuhan Cao, Wenguo Ning, Le Luo · IEEE Transactions on Electronics Packaging Manufacturing · 2009 · 43 citations

Engineering, Wafer-level Package, Solder Bonding +16

Wafer level hermetic packaging based on Cu–Sn isothermal solidification technology

Yuhan Cao, Le Luo · Journal of Semiconductors · 2009 · 20 citations

Engineering, Advanced Packaging (Semiconductors), Material Processing +16

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