Le Luo

Publications

Citations

H-Index

2009

Active since

Affiliations

Shanghai Institute of Microsystem and Information Technology(Current)

Le Luo is an author at Shanghai Institute of Microsystem and Information Technology specializing in advanced packaging, electronic packaging, and electrical engineering.

Top concepts

EngineeringMicroelectronicsAdvanced PackagingIntegrated CircuitsElectronic PackagingElectrical EngineeringApplied PhysicsOptoelectronicsMicrofabricationComputer Engineering

Publications per year

2009–2010

Publications

Wafer-Level Package With Simultaneous TSV Connection and Cavity Hermetic Sealing by Solder Bonding for MEMS Device

Yuhan Cao, Wenguo Ning, Le Luo · IEEE Transactions on Electronics Packaging Manufacturing · 2009 · 43 citations

Engineering, Wafer-level Package, Solder Bonding +16

An MCM package process for 24GHz driver amplifier using photosensitive BCB

Jiajie Tang, Huajiang Wang, Xiao Dong Chen et al. · 2010 · 10 citations

Engineering, Microwave Transmission, Multilayer Interconnection +17

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