Microelectronics Reliability · 2001 · 23 citations · 1 references
EngineeringElectrical EngineeringMicroelectromechanical SystemsMicrofabricationPackaging DesignChip PackagingDevice CharacterizationDevice ReliabilityMems ReliabilityReliabilitySemiconductor ReliabilityFlip-chip PackagingPackage ReliabilityPackaging Reliability
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Adhesive flip chip bonding on flexible substrates
R. Aschenbrenner, R. Miessner, H. Reichl · 1997 · 38 citations