Concepedia

Influence of diffusion barriers on the nucleation and growth of CVD Cu for interconnect applications

Roland Kröger, M. Eizenberg, D. Cong, N. Yoshida, L. Y. Chen, S. Ramaswami, D. Carl

Microelectronic Engineering · 2000 · 14 citations · 3 references

DOI

Concepts

References

3

Chemical Vapor Deposition of Copper from Hexafluoroacetylacetonato Copper(I) Vinyltrimethylsilane: Deposition Rates, Mechanism, Selectivity, Morphology, and Resistivity as a Function of Temperature and Pressure

Ajay K. Jain, K. ‐M., Toivo T. Kodas et al. · Journal of The Electrochemical Society · 1993 · 109 citations

, , +16

Selective and blanket copper chemical vapor deposition for ultra-large-scale integration

Ajay K. Jain, Toivo T. Kodas, Rahul Jairath et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 1993 · 94 citations

, , +13

Chemical vapor deposition of copper from CuI hexafluoroacetylacetonate trimethylvinylsilane for ultralarge scale integration applications

G. Braeckelmann, D. Manger, Aaron R. Burke et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 1996 · 29 citations

, , +17