S. Ramaswami

Statistics

Publications

Citations

184

H-Index

Active since

1992

Affiliations

Applied Materials (United States)(Current)

Technion – Israel Institute of Technology

S. Ramaswami is an author at Applied Materials (United States) specializing in semiconductor devices, engineering, and integrated circuit fabrication.

Publications per year

1992–2011

Publications

Process Integration Considerations for 300 mm TSV Manufacturing

S. Ramaswami, John Dukovic, Brad Eaton et al. · IEEE Transactions on Device and Materials Reliability · 2009 · 62 citations

Engineering, Computer Engineering, Manufacturing Engineering +17

Properties of Copper Films Prepared by Chemical Vapor Deposition for Advanced Metallization of Microelectronic Devices

Roland Kröger, M. Eizenberg, D. Cong et al. · Journal of The Electrochemical Society · 1999 · 44 citations

Natural Sciences, Materials Engineering, Materials Science +17

Formation of TSV for the stacking of advanced logic devices utilizing bumpless wafer-on-wafer technology

D. Diehl, Hideki Kitada, Noritoshi Maeda et al. · Microelectronic Engineering · 2011 · 29 citations

Engineering, Computer Engineering, Electrical Engineering +13

Through-silicon-via technology for 3D integration

John Dukovic, S. Ramaswami, Sharma Pamarthy et al. · 2010 · 25 citations

Engineering, Computer Engineering, Electrical Engineering +17

Influence of diffusion barriers on the nucleation and growth of CVD Cu for interconnect applications

Roland Kröger, M. Eizenberg, D. Cong et al. · Microelectronic Engineering · 2000 · 14 citations

Natural Sciences, Materials Engineering, Materials Science +16

1–5 of 6