Concepedia

D. Cong

DC

Statistics

Publications

5

Citations

133

H-Index

5

Active since

1999

Affiliations

Applied Materials (United States)(Current)

Technion – Israel Institute of Technology

D. Cong is an author at Applied Materials (United States) specializing in materials science, natural sciences, and materials engineering.

Publications per year

1999–2000

5

Publications

5

Properties of Copper Films Prepared by Chemical Vapor Deposition for Advanced Metallization of Microelectronic Devices

Roland Kröger, M. Eizenberg, D. Cong et al. · Journal of The Electrochemical Society · 1999 · 44 citations

, , +17

Adhesion studies of CVD copper metallization

Srinivas Gandikota, Steve Voss, Rong Tao et al. · Microelectronic Engineering · 2000 · 41 citations

, , +13

Chemical studies of CVD Cu deposited on Ta and TaN barriers under various process conditions

Steve Voss, Srinivas Gandikota, Liang-Yuh Chen et al. · Microelectronic Engineering · 2000 · 18 citations

, , +12

The role of kinetics in the nucleation and void formation in copper films produced by chemical vapor deposition

Roland Kröger, M. Eizenberg, Eugen Rabkin et al. · Journal of Applied Physics · 2000 · 16 citations

, , +17

Influence of diffusion barriers on the nucleation and growth of CVD Cu for interconnect applications

Roland Kröger, M. Eizenberg, D. Cong et al. · Microelectronic Engineering · 2000 · 14 citations

, , +16

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