Concepedia

Brad Eaton

BE

Statistics

Publications

4

Citations

144

H-Index

4

Active since

2009

Affiliations

Applied Materials (United States)(Current)

Brad Eaton is an author at Applied Materials (United States) specializing in semiconductor devices, integrated circuit fabrication, and engineering.

Publications per year

2009–2012

4

Publications

4

Process Integration Considerations for 300 mm TSV Manufacturing

S. Ramaswami, John Dukovic, Brad Eaton et al. · IEEE Transactions on Device and Materials Reliability · 2009 · 62 citations

Engineering, Computer Engineering, Manufacturing Engineering +17

Formation of TSV for the stacking of advanced logic devices utilizing bumpless wafer-on-wafer technology

D. Diehl, Hideki Kitada, Noritoshi Maeda et al. · Microelectronic Engineering · 2011 · 29 citations

Engineering, Computer Engineering, Electrical Engineering +13

Robust TSV via-middle and via-reveal process integration accomplished through characterization and management of sources of variation

Niranjan Kumar, Sesh Ramaswami, John Dukovic et al. · 2012 · 28 citations

Engineering, Electrical Engineering, Materials Science +17

Through-silicon-via technology for 3D integration

John Dukovic, S. Ramaswami, Sharma Pamarthy et al. · 2010 · 25 citations

Engineering, Computer Engineering, Electrical Engineering +17

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