Applied Physics Letters · 2004 · 31 citations · 9 references
Natural SciencesMaterials SciencePhysicsElectronic MaterialsMaterials PhysicsTransport PhenomenaCarrier TransportCurrent DistributionDiffusion In SolidsMass TransferMass TransportMetalsAtomic Diffusion Across InterfacesCurrent CrowdingElectromigrationElectromigration AnalysisFlux DivergenceMass Transport AnalysisMass Transport PhenomenaVoid Nucleation
To assess the relevance of current crowding to electromigration-induced mass transport, a test structure was designed to structurally induce and accelerate current crowding in Cu damascene lines. Electromigration experiments and quantitative finite element analysis demonstrate how current crowding can substantially enhance local atomic flux along critical diffusion paths. The resulting flux divergence leads to rapid void nucleation and growth. The observed increase in atomic flux and flux divergence is also moderately affected by the presence of Joule-heating-induced temperature gradients.
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Electromigration path in Cu thin-film lines
C.‐K. Hu, R. Rosenberg, K. Y. Lee · Applied Physics Letters · 1999 · 329 citations
Natural Sciences, Materials Engineering, Materials Science +17
Reduced electromigration of Cu wires by surface coating
C.‐K. Hu, Lynne Gignac, R. Rosenberg et al. · Applied Physics Letters · 2002 · 215 citations
Natural Sciences, Electrical Engineering, Materials Engineering +17
Copper metallization reliability
J. R. Lloyd, Jack Clemens, R Snede · Microelectronics Reliability · 1999 · 167 citations