High temperature storage reliability investigation of the Al–Cu wire bond interface

Constitution of Binary Alloys

Max Hansen, K. Anderko, H. W. Salzberg · Journal of The Electrochemical Society · 1958 · 14.8K citations

Natural Sciences, Chemistry, Materials Science +8

Behavior of aluminum oxide, intermetallics and voids in Cu–Al wire bonds

Huining Xu, C. Liu, Vadim V. Silberschmidt et al. · Acta Materialia · 2011 · 246 citations

Natural Sciences, Materials Engineering, Materials Science +12

Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging

C.J. Hang, Chunqing Wang, M. Mayer et al. · Microelectronics Reliability · 2007 · 244 citations

Natural Sciences, Materials Engineering, Materials Science +13

Effects of Cu/Al intermetallic compound (IMC) on copper wire and aluminum pad bondability

Hyoung-Joon Kim, Joo Yeon Lee, Kyung-Wook Paik et al. · IEEE Transactions on Components and Packaging Technologies · 2003 · 224 citations

Natural Sciences, Materials Engineering, Materials Science +17

Interdiffusion in the Al–Cu System

Yasuhiro Funamizu, Katsuya Watanabe · Transactions of the Japan Institute of Metals · 1971 · 197 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17