Concepedia

Bonding Interface Characterization

Bonding Interface Characterization is a systematic analytical process within wafer bonding that identifies and quantifies the physical, chemical, and structural properties of the junction between bonded substrates to assess bond quality, integrity, and reliability.

273

Publications

8.7K

Citations

1.2K

Authors

367

Institutions

Publications per year

2017–2026

82

Parents

Publications

273

General aspects of interface bonding in kinetic sprayed coatings

Gyuyeol Bae, Yuming Xiong, Santosh Kumar et al. · Acta Materialia · 2008 · 478 citations

, , +16

Room temperature Cu–Cu direct bonding using surface activated bonding method

T. H. Kim, M.M.R. Howlader, Toshihiro Itoh et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 2003 · 335 citations

, , +15

Experimental study on CFRP-to-steel bonded interfaces

Tao Yu, Dilum Fernando, J.G. Teng et al. · Composites Part B Engineering · 2012 · 335 citations

, , +12

Morphology and Bond Strength of Copper Wafer Bonding

Kuan‐Neng Chen, Chuan Seng Tan, Andy Fan et al. · Electrochemical and Solid-State Letters · 2003 · 163 citations

, , +14

Quantitative Studies on PDMS-PDMS Interface Bonding with Piranha Solution and its Swelling Effect

Kai Seng Koh, Jit Kai Chin, Joanna Su Yuin Chia et al. · Micromachines · 2012 · 114 citations · Full text

, , +16

1–5 of 273

Authors

1.2K

  1. KC
    Kuan‐Neng Chen

    National Yang Ming Chiao Tung University, Taiwan

    6 publications · 375 citations

    6

    h-index

  2. TS
    Tadatomo Suga

    The University of Tokyo, Japan

    6 publications · 487 citations

    6

    h-index

  3. TK
    Tomoaki Kawamura

    NTT (Japan), Japan

    5 publications · 77 citations

    5

    h-index

  4. CW
    Chunqing Wang

    Harbin Institute of Technology, China

    4 publications · 104 citations

    4

    h-index

  5. SR
    Siva Rama Krishna Vanjari

    Indian Institute of Technology Hyderabad, India

    3 publications · 49 citations

    3

    h-index

1–5 of 1.2K

Institutions

367

  1. The University of Tokyo

    Tokyo, Japan

    11 h-index

    33 publications

    2.1K citations

  2. Institut polytechnique de Grenoble

    Grenoble, France

    6 h-index

    25 publications

    1.1K citations

  3. Commissariat à l'Énergie Atomique et aux Énergies Alternatives

    Paris, France

    6 h-index

    29 publications

    1.3K citations

  4. Université Grenoble Alpes

    Saint-Martin-d'Hères, France

    6 h-index

    25 publications

    1.1K citations

  5. Laboratoire d'Électronique des Technologies de l'Information

    Grenoble, France

    6 h-index

    27 publications

    846 citations

  6. Massachusetts Institute of Technology

    Cambridge, United States

    5 h-index

    18 publications

    1.4K citations

  7. Harbin Institute of Technology

    Harbin, China

    5 h-index

    21 publications

    639 citations

  8. Northwestern Polytechnical University

    Xi'an, China

    5 h-index

    20 publications

    342 citations

1–8 of 367

Venues

  1. Sensors and Actuators A Physical

    12 publications · 402 citations

    12

    h-index

  2. Japanese Journal of Applied Physics

    JJAP · 12 publications · 223 citations

    11

    h-index

  3. Applied Physics Letters

    9 publications · 260 citations

    9

    h-index

  4. Microelectronics Reliability

    7 publications · 146 citations

    7

    h-index

  5. Journal of Electronic Materials

    JEM · 6 publications · 295 citations

    6

    h-index

1–5