The Influence of an Imposed Current on the Creep of Sn-Ag-Cu Solder

Effect of thermal aging on the interfacial structure of SnAgCu solder joints on Cu

Weiqun Peng, Eduardo Franco de Monlevade, Marco E. Marques · Microelectronics Reliability · 2007 · 149 citations

Natural Sciences, Materials Engineering, Materials Science +14

Mechanical and microstructural properties of SnAgCu solder joints

Janne J. Sundelin, Sami T. Nurmi, T. Lepistö et al. · Materials Science and Engineering A · 2006 · 115 citations

Natural Sciences, Materials Engineering, Materials Science +13

Microstructure and creep behaviour of eutectic SnAg and SnAgCu solders

Steffen Wiese, K.-J. Wolter · Microelectronics Reliability · 2004 · 103 citations

Natural Sciences, Materials Engineering, Materials Science +13

The creep properties of lead-free solder joints

Hongxin Song, J. W. Morris, F. Hua · JOM · 2002 · 101 citations

Natural Sciences, Materials Engineering, Materials Science +12

Measurement of deformations in SnAgCu solder interconnects under in situ thermal loading

Seungbae Park, Ramji Dhakal, L.P. Lehman et al. · Acta Materialia · 2007 · 99 citations

Engineering, Materials Engineering, Materials Science +14