Concepedia

Kuo-Chuan Liu

KL

Statistics

Publications

13

Citations

378

H-Index

11

Active since

2008

Affiliations

Cisco Systems (United States)(Current)

National Tsing Hua University

Michigan State University

University of California, Berkeley

Cisco Systems (China)

Kuo-Chuan Liu is an author at Cisco Systems (United States) specializing in materials engineering, materials science, and engineering.

Publications per year

2008–2012

13

Publications

13

Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Surface Finish Effects

Tae-Kyu Lee, Hongtao Ma, Kuo-Chuan Liu et al. · Journal of Electronic Materials · 2010 · 78 citations

Engineering, Electrical Engineering, Materials Engineering +17

Suppressing Ni3Sn4 formation in the Sn–Ag–Cu solder joints with Ni–P/Pd/Au surface finish

Chien-Fu Tseng, Tae-Kyu Lee, Gnyaneshwar Ramakrishna et al. · Materials Letters · 2011 · 56 citations

Natural Sciences, Materials Engineering, Materials Science +14

Effects of Minor Ni Doping on Microstructural Variations and Interfacial Reactions in Cu/Sn-3.0Ag-0.5Cu-xNi/Au/Ni Sandwich Structures

Chi-Yang Yu, Tae-Kyu Lee, Michael Tsai et al. · Journal of Electronic Materials · 2010 · 39 citations

Natural Sciences, Materials Engineering, Materials Science +15

Impact of 5% NaCl Salt Spray Pretreatment on the Long-Term Reliability of Wafer-Level Packages with Sn-Pb and Sn-Ag-Cu Solder Interconnects

Bo Liu, Tae-Kyu Lee, Kuo-Chuan Liu · Journal of Electronic Materials · 2011 · 36 citations

Engineering, Materials Engineering, Materials Science +13

The Influence of an Imposed Current on the Creep of Sn-Ag-Cu Solder

Christopher Kinney, J. W. Morris, Tae-Kyu Lee et al. · Journal of Electronic Materials · 2008 · 34 citations

Natural Sciences, Materials Engineering, Materials Science +10

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