Concepedia

Chi-Yang Yu

CY

Statistics

Publications

16

Citations

434

H-Index

12

Active since

2006

Affiliations

National Tsing Hua University(Current)

Cisco Systems (United States)

Chi-Yang Yu is an author at National Tsing Hua University specializing in engineering, materials science, and materials engineering.

ORCID

Top concepts

Publications per year

2006–2014

16

Publications

16

Stabilization of hexagonal Cu6(Sn,Zn)5 by minor Zn doping of Sn-based solder joints

Chi-Yang Yu, Jenq‐Gong Duh · Scripta Materialia · 2011 · 61 citations

, , +10

Interfacial Reaction of Sn and Cu-xZn Substrates After Reflow and Thermal Aging

Chi-Yang Yu, Kai-Jheng Wang, Jenq‐Gong Duh · Journal of Electronic Materials · 2009 · 54 citations

, , +10

Suppressing the growth of Cu–Sn intermetallic compounds in Ni/Sn–Ag–Cu/Cu–Zn solder joints during thermal aging

Chi-Yang Yu, Wei-Yu Chen, Jenq‐Gong Duh · Intermetallics · 2012 · 42 citations

, , +5

Improving the impact toughness of Sn–Ag–Cu/Cu–Zn Pb-free solder joints under high speed shear testing

Chi-Yang Yu, Wei-Yu Chen, Jenq‐Gong Duh · Journal of Alloys and Compounds · 2013 · 40 citations

, , +4

Effects of Minor Ni Doping on Microstructural Variations and Interfacial Reactions in Cu/Sn-3.0Ag-0.5Cu-xNi/Au/Ni Sandwich Structures

Chi-Yang Yu, Tae-Kyu Lee, Michael Tsai et al. · Journal of Electronic Materials · 2010 · 38 citations

, , +9

1–5 of 16