Suppressing the growth of Cu–Sn intermetallic compounds in Ni/Sn–Ag–Cu/Cu–Zn solder joints during thermal aging

Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys

Kil-Won Moon, W. J. Boettinger, Ursula R. Kattner et al. · Journal of Electronic Materials · 2000 · 557 citations

Natural Sciences, Materials Engineering, Materials Science +14

Interstitial Diffusion of Copper in Tin

B. F. Dyson, T. R. Anthony, David Turnbull · Journal of Applied Physics · 1967 · 382 citations

Natural Sciences, Materials Engineering, Materials Science +6

Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys

Kazuhiro Nogita · Intermetallics · 2009 · 191 citations

Natural Sciences, Materials Engineering, Materials Science +12

Extreme Fast-Diffusion System: Nickel in Single-Crystal Tin

D. C. Yeh, H. B. Huntington · Physical Review Letters · 1984 · 188 citations

Natural Sciences, Materials Science, Physics +14

First-principles investigation of the structural and electronic properties of Cu6−xNixSn5 (x=0, 1, 2) intermetallic compounds

Chun Yu, Junyan Liu, Hao Lü et al. · Intermetallics · 2007 · 115 citations

Natural Sciences, Materials Science, Physics +16