Concepedia

Kai-Jheng Wang

KW

4

Publications

141

Citations

4

H-Index

2007

Active since

Affiliations

National Tsing Hua University(Current)

Kai-Jheng Wang is an author at National Tsing Hua University specializing in engineering, materials science, and chemistry.

Top concepts

Publications per year

2007–2010

4

Publications

4

Interfacial Reaction of Sn and Cu-xZn Substrates After Reflow and Thermal Aging

Chi-Yang Yu, Kai-Jheng Wang, Jenq‐Gong Duh · Journal of Electronic Materials · 2009 · 54 citations

, , +10

Detailed Phase Evolution of a Phosphorous-Rich Layer and Formation of the Ni-Sn-P Compound in Sn-Ag-Cu/Electroplated Ni-P Solder Joints

Yung‐Chi Lin, Kai-Jheng Wang, Jenq‐Gong Duh · Journal of Electronic Materials · 2009 · 45 citations

, , +8

Inhibiting AuSn4 Formation by Controlling the Interfacial Reaction in Solder Joints

Li‐Yin Hsiao, Guh-Yaw Jang, Kai-Jheng Wang et al. · Journal of Electronic Materials · 2007 · 24 citations

, , +7

Interfacial Reactions of Sn-3.0Ag-0.5Cu Solder with Cu-Mn UBM During Aging

Chien-Fu Tseng, Kai-Jheng Wang, Jenq‐Gong Duh · Journal of Electronic Materials · 2010 · 18 citations

, , +7

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