Yung‐Chi Lin

Phase transformation of the phosphorus-rich layer in SnAgCu/Ni–P solder joints

Yung‐Chi Lin, Jenq‐Gong Duh · Scripta Materialia · 2006 · 67 citations

Natural Sciences, Materials Engineering, Materials Science +13

Suppressing Ni–Sn–P growth in SnAgCu/Ni–P solder joints

Yung‐Chi Lin, Toung-Yi Shih, Shih-Kang Tien et al. · Scripta Materialia · 2006 · 58 citations

Natural Sciences, Materials Engineering, Materials Science +6

Assessing 10- to 11-year-old children’s performance and misconceptions in number sense using a four-tier diagnostic test

Der‐Ching Yang, Yung‐Chi Lin · Educational Research · 2015 · 56 citations

Education, Educational Assessment, Mathematics Education +14

Detailed Phase Evolution of a Phosphorous-Rich Layer and Formation of the Ni-Sn-P Compound in Sn-Ag-Cu/Electroplated Ni-P Solder Joints

Yung‐Chi Lin, Kai-Jheng Wang, Jenq‐Gong Duh · Journal of Electronic Materials · 2009 · 45 citations

Natural Sciences, Materials Engineering, Materials Science +13

Effect of surfactant on electrodeposited Ni–P layer as an under bump metallization

Yung‐Chi Lin, Jenq‐Gong Duh · Journal of Alloys and Compounds · 2006 · 34 citations

Natural Sciences, Materials Engineering, Materials Science +14