Phase transformation of the phosphorus-rich layer in SnAgCu/Ni–P solder joints

Scanning Electron Microscopy and X-Ray Microanalysis

Gerhard Eisenbeis · Micron · 2003 · 700 citations

Natural Sciences, Materials Engineering, Materials Science +12

Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology

Jihun Jang, P. G. Kim, K. N. Tu et al. · Journal of Applied Physics · 1999 · 283 citations

Natural Sciences, Materials Engineering, Materials Science +17

Morphology of interfacial reaction between lead-free solders and electroless Ni–P under bump metallization

Jihun Jang, D. R. Frear, T. Y. Lee et al. · Journal of Applied Physics · 2000 · 192 citations

Natural Sciences, Materials Engineering, Materials Science +14

Interfacial reactions during soldering with lead-tin eutectic and lead (Pb)-free, tin-rich solders

S. K. Kang, S. Purushothaman · Journal of Electronic Materials · 1996 · 162 citations

Natural Sciences, Materials Engineering, Materials Science +12

Spalling of Cu6Sn5 spheroids in the soldering reaction of eutectic SnPb on Cr/Cu/Au thin films

Ann A. Liu, H. K. Kim, K. N. Tu et al. · Journal of Applied Physics · 1996 · 132 citations

Natural Sciences, Materials Engineering, Materials Science +16