Statistics
Publications
19
Citations
784
H-Index
17
Active since
1996
Affiliations
Shih-Kang Tien is an author at National Tsing Hua University specializing in materials science, materials engineering, and natural sciences.
Publications per year
1996–2009
19
19
Suppressing Ni–Sn–P growth in SnAgCu/Ni–P solder joints
Yung‐Chi Lin, Toung-Yi Shih, Shih-Kang Tien et al. · Scripta Materialia · 2006 · 58 citations
Natural Sciences, Materials Engineering, Materials Science +6
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