Chien-Fu Tseng

Suppressing Ni3Sn4 formation in the Sn–Ag–Cu solder joints with Ni–P/Pd/Au surface finish

Chien-Fu Tseng, Tae-Kyu Lee, Gnyaneshwar Ramakrishna et al. · Materials Letters · 2011 · 56 citations

Materials Engineering, Materials Science, Chemical Engineering +8

Correlation between microstructure evolution and mechanical strength in the Sn–3.0Ag–0.5Cu/ENEPIG solder joint

Chien-Fu Tseng, Jenq‐Gong Duh · Materials Science and Engineering A · 2013 · 53 citations

Materials Science, Engineering, Severe Plastic Deformation +9

The influence of Pd on growth behavior of a quaternary (Cu,Ni,Pd)6Sn5 compound in Sn–3.0Ag–0.5Cu/Au/Pd/Ni–P solder joint during a liquid state reaction

Chien-Fu Tseng, Jenq‐Gong Duh · Journal of Materials Science · 2012 · 28 citations

Materials Engineering, Materials Science, Chemical Engineering +6

Roles of Cu in Pb-free solders jointed with electroless Ni(P) plating

Chien-Fu Tseng, Christine Jill Lee, Jenq‐Gong Duh · Materials Science and Engineering A · 2013 · 27 citations

Materials Science, Materials Engineering, Electrical Engineering +7

Improved strength of boron-doped Sn-1.0Ag-0.5Cu solder joints under aging conditions

Hyelim Choi, Tae-Kyu Lee, Yunsung Kim et al. · Intermetallics · 2011 · 26 citations

Materials Engineering, Materials Science, Engineering +6