Correlation between microstructure evolution and mechanical strength in the Sn–3.0Ag–0.5Cu/ENEPIG solder joint

Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology

Jihun Jang, P. G. Kim, K. N. Tu et al. · Journal of Applied Physics · 1999 · 282 citations

Engineering, Crystal Growth Technology, Solid-state Chemistry +17

Influence of interfacial intermetallic compound on fracture behavior of solder joints

Hwa-Teng Lee, Ming‐Hung Chen, Huei-Mei Jao et al. · Materials Science and Engineering A · 2003 · 242 citations

Materials Science, Friction Welding, Engineering +9

Microstructures and crystallization of electroless Ni-P deposits

Kang‐Heon Hur, Jae-Han Jeong, Dong Nyung Lee · Journal of Materials Science · 1990 · 191 citations

Materials Science, Engineering, Surface Electrochemistry +3

Morphology of interfacial reaction between lead-free solders and electroless Ni–P under bump metallization

Jihun Jang, D. R. Frear, T. Y. Lee et al. · Journal of Applied Physics · 2000 · 191 citations

Engineering, Bump Metallization, Solid State +16

A study on the microstructure and phase transformation of electroless nickel deposits

Su Hoon Park, Dong Nyung Lee · Journal of Materials Science · 1988 · 109 citations

Materials Science, Electrometallurgy, Engineering +8