Roles of Cu in Pb-free solders jointed with electroless Ni(P) plating

Lead-free Solders in Microelectronics

Mulugeta Abtew, Guna S Selvaduray · Materials Science and Engineering R Reports · 2000 · 1.9K citations

Electrical Engineering, Miniaturization, Engineering +6

Six cases of reliability study of Pb-free solder joints in electronic packaging technology

Ke Zeng, K. N. Tu · Materials Science and Engineering R Reports · 2002 · 1.3K citations

Reliability, Electrical Engineering, Reliability Engineering +10

Tin–lead (SnPb) solder reaction in flip chip technology

K. N. Tu, Ke Zeng · Materials Science and Engineering R Reports · 2001 · 587 citations

Materials Science, Engineering, Advanced Packaging (Semiconductors) +4

Physics and materials challenges for lead-free solders

K. N. Tu, Andriy Gusak, M. Li · Journal of Applied Physics · 2003 · 353 citations

Materials Engineering, Materials Science, Materials Challenges +15

Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology

Jihun Jang, P. G. Kim, K. N. Tu et al. · Journal of Applied Physics · 1999 · 282 citations

Engineering, Crystal Growth Technology, Solid-state Chemistry +17