Gnyaneshwar Ramakrishna

Statistics

Publications

Citations

187

H-Index

Active since

2003

Affiliations

Georgia Institute of Technology(Current)

Quality and Reliability (Greece)

Cisco Systems (United States)

Gnyaneshwar Ramakrishna is an author at Georgia Institute of Technology specializing in materials science, materials engineering, and thermomechanical stress.

Publications per year

2003–2011

Publications

Kirkendall voids at Cu/solder interface and their effects on solder joint reliability

Z. Mei, Mudasir Ahmad, Mason Hu et al. · 2005 · 64 citations

Natural Sciences, Materials Engineering, Materials Science +17

Suppressing Ni3Sn4 formation in the Sn–Ag–Cu solder joints with Ni–P/Pd/Au surface finish

Chien-Fu Tseng, Tae-Kyu Lee, Gnyaneshwar Ramakrishna et al. · Materials Letters · 2011 · 56 citations

Natural Sciences, Materials Engineering, Materials Science +14

Role of dielectric material and geometry on the thermo-mechanical reliability of microvias

Gnyaneshwar Ramakrishna, Fuhan Liu, Srikrishna Sitaraman · 2003 · 27 citations

Engineering, Materials Engineering, Materials Science +17

Experimental and numerical investigation of microvia reliability

Gnyaneshwar Ramakrishna, Fuhan Liu, Srikrishna Sitaraman · 2003 · 22 citations

Engineering, Electrical Engineering, Materials Science +16

Modeling spatial strain gradient effects in thermo-mechanical fatigue of copper microstructures

Raghuram V. Pucha, Gnyaneshwar Ramakrishna, S. Mahalingam et al. · International Journal of Fatigue · 2004 · 18 citations

Natural Sciences, Materials Engineering, Materials Science +16

1–5 of 5