Srikrishna Sitaraman

The SOP for Miniaturized, Mixed-Signal Computing, Communication, and Consumer Systems of the Next Decade

Rao Tummala, Madhavan Swaminathan, Manos M. Tentzeris et al. · IEEE Transactions on Advanced Packaging · 2004 · 152 citations

Engineering, Computer Engineering, Electrical Engineering +15

β-Helix: A lithography-based compliant off-chip interconnect

Qi Zhu, Lunyu Ma, Srikrishna Sitaraman · IEEE Transactions on Components and Packaging Technologies · 2003 · 30 citations

Engineering, Materials Science, Mechanical Engineering +17

Miniaturized Bandpass Filters as Ultrathin 3-D IPDs and Embedded Thinfilms in 3-D Glass Modules

Srikrishna Sitaraman, Vijay Sukumaran, P. Markondeya Raj et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2017 · 30 citations

Engineering, Electrical Engineering, Materials Science +14

Ultra-miniaturized and surface-mountable glass-based 3D IPAC packages for RF modules

Yoichiro Sato, Srikrishna Sitaraman, Vijay Sukumaran et al. · 2013 · 29 citations

Engineering, Electrical Engineering, Materials Science +17

Measurement and Analysis of Glass Interposer Power Distribution Network Resonance Effects on a High-Speed Through Glass Via Channel

Youngwoo Kim, Jonghyun Cho, Jonghoon J. Kim et al. · IEEE Transactions on Electromagnetic Compatibility · 2016 · 29 citations

Engineering, Electrical Engineering, Circuit Theory +12