Srikrishna Sitaraman

The SOP for Miniaturized, Mixed-Signal Computing, Communication, and Consumer Systems of the Next Decade

Rao Tummala, Madhavan Swaminathan, Manos M. Tentzeris et al. · IEEE Transactions on Advanced Packaging · 2004 · 152 citations

Engineering, Device Integration, Computer Architecture +25

Miniaturized Bandpass Filters as Ultrathin 3-D IPDs and Embedded Thinfilms in 3-D Glass Modules

Srikrishna Sitaraman, Vijay Sukumaran, P. Markondeya Raj et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2017 · 30 citations

Engineering, Optical Glass, Glass Material +17

β-Helix: A lithography-based compliant off-chip interconnect

Qi Zhu, Lunyu Ma, Srikrishna Sitaraman · IEEE Transactions on Components and Packaging Technologies · 2003 · 29 citations

Advanced Packaging, Mechanical Compliance, Wafer Scale Processing +10

Ultra-miniaturized and surface-mountable glass-based 3D IPAC packages for RF modules

Yoichiro Sato, Srikrishna Sitaraman, Vijay Sukumaran et al. · 2013 · 29 citations

Thin Glass Substrate, Engineering, Electromagnetic Compatibility +18

Role of dielectric material and geometry on the thermo-mechanical reliability of microvias

Gnyaneshwar Ramakrishna, Fuhan Liu, Srikrishna Sitaraman · 2003 · 27 citations

Engineering, Micromechanics, Mechanical Engineering +20