Concepedia

Guh-Yaw Jang

GJ

10

Publications

315

Citations

10

H-Index

2003

Active since

Affiliations

National Tsing Hua University(Current)

Taiwan Semiconductor Manufacturing Company (Taiwan)

Guh-Yaw Jang is an author at National Tsing Hua University specializing in materials science, engineering, and microstructure.

Top concepts

EngineeringMaterial ScienceMicrostructureApplied PhysicsMaterials EngineeringElectronic PackagingCorrosionMicroelectronicsSurface ScienceElectrical Engineering

Publications per year

2003–2007

10

Publications

10

The nanoindentation characteristics of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds in the solder bump

Guh-Yaw Jang, Jyh‐Wei Lee, Jeng‐Gong Duh · Journal of Electronic Materials · 2004 · 128 citations

Materials Engineering, Materials Science, Ni3sn4 Intermetallic Compounds +10

Mechanism of interfacial reaction for the Sn-Pb solder bump with Ni/Cu under-bump metallization in flip-chip technology

Guh-Yaw Jang, Chien-Sheng Huang, Li‐Yin Hsiao et al. · Journal of Electronic Materials · 2004 · 33 citations

Materials Science, Materials Engineering, Interfacial Reaction +12

The effect of intermetallic compound morphology on Cu diffusion in Sn-Ag and Sn-Pb solder bump on the Ni/Cu Under-bump metallization

Guh-Yaw Jang, Jenq‐Gong Duh · Journal of Electronic Materials · 2005 · 26 citations

Materials Engineering, Materials Science, Engineering +8

elemental redistribution and interfacial reaction mechanism for the flip chip Sn-3.0Ag-(0.5 or 1.5)Cu solder bump with Al/Ni(V)/Cu under-Bump metallization during aging

Guh-Yaw Jang, Jenq‐Gong Duh · Journal of Electronic Materials · 2006 · 25 citations

Materials Engineering, Materials Science, Cu Solder Bump +12

Inhibiting AuSn4 Formation by Controlling the Interfacial Reaction in Solder Joints

Li‐Yin Hsiao, Guh-Yaw Jang, Kai-Jheng Wang et al. · Journal of Electronic Materials · 2007 · 24 citations

Materials Engineering, Materials Science, Interfacial Reaction +7

Rows per page

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