The effect of intermetallic compound morphology on Cu diffusion in Sn-Ag and Sn-Pb solder bump on the Ni/Cu Under-bump metallization

Tin–lead (SnPb) solder reaction in flip chip technology

K. N. Tu, Ke Zeng · Materials Science and Engineering R Reports · 2001 · 587 citations

Materials Science, Engineering, Advanced Packaging (Semiconductors) +4

Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening

H. K. Kim, K. N. Tu · Physical review. B, Condensed matter · 1996 · 501 citations

Engineering, Mechanical Engineering, Chemistry +17

Controlled Collapse Reflow Chip Joining

Lincoln Miller · IBM Journal of Research and Development · 1969 · 363 citations

Materials Science, Advanced Packaging, Chip-scale Package +14

Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni

Cheng–En Ho, Rung‐Ywan Tsai, Y. L. Lin et al. · Journal of Electronic Materials · 2002 · 324 citations

Materials Science, Materials Engineering, Chemical Engineering +8

Pb-free solders for flip-chip interconnects

D. R. Frear, Jihun Jang, J. K. Lin et al. · JOM · 2001 · 316 citations

Electrical Engineering, Engineering, Advanced Packaging (Semiconductors) +5