Concepedia

Jeng‐Gong Duh

JD

7

Publications

247

Citations

7

H-Index

1988

Active since

Affiliations

National Tsing Hua University(Current)

National Yang Ming Chiao Tung University

Jeng‐Gong Duh is an author at National Tsing Hua University specializing in engineering, materials science, and applied physics.

Top concepts

Publications per year

1988–2006

7

Publications

7

The nanoindentation characteristics of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds in the solder bump

Guh-Yaw Jang, Jyh‐Wei Lee, Jeng‐Gong Duh · Journal of Electronic Materials · 2004 · 128 citations

, , +10

Characterizing the formation and growth of intermetallic compound in the solder joint

Yao‐Tsung Lee, Jeng‐Gong Duh · Journal of Materials Science · 1998 · 35 citations

Intermetallic formation on the fracture of Sn/Pb solder and Pd/Ag conductor interfaces

Bi-Shio Chiou, K.C. Liu, Jeng‐Gong Duh et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1990 · 30 citations

, , +20

Influence of Cu content on compound formation near the chip side for the flip-chip Sn-3.0Ag-(0.5 or 1.5)Cu solder bump during aging

Guh-Yaw Jang, Jeng‐Gong Duh, Hideyuki Takahashi et al. · Journal of Electronic Materials · 2006 · 15 citations

, , +8

Characteristics and porcelain bond strength of (Ti,Al)N coating on dental alloys

Kwok‐Hung Chung, Jeng‐Gong Duh, Daehwan Shin et al. · Journal of Biomedical Materials Research · 2002 · 14 citations

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