Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Surface Finish Effects

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Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening

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Metallurgy of low temperature Pb-free solders for electronic assembly

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Characterization of eutectic Sn-Bi solder joints

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