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Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Surface Finish Effects

Materials EngineeringMaterials ScienceElectrical EngineeringEngineeringAdvanced Packaging (Semiconductors)Hardware ReliabilityIsothermal AgingLong-term ReliabilityChip AttachmentHeat TransferElectronic PackagingMicroelectronicsSn-ag-cu SolderDevice Reliability