Jie Xue - Concepedia

Author

Jie Xue

Cisco Systems (United States)

Also Known As

Jie XUE, Jie Xue, Xue Jie Ma, Xue, Jie

Publications

424

Citations

H-Index

Concepts

All Affiliations

Cisco Systems (United States)Cisco Systems (China)Industrial Technology Research Institute

About

Jie Xue is an author at Cisco Systems (United States) specializing in engineering, microelectronics, and electronic packaging.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	10	11	321
2	Electrical Engineering	9	9	271
3	Computer Engineering	7	7	188
4	Applied Physics	4	4	82
5	Industrial Engineering	1	1	15

Jie Xue

Publications

321

Citations

H-Index

Page 1

	Year	Citations
Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Surface Finish Effects Tae-Kyu Lee, Hongtao Ma, Kuo-Chuan Liu, Journal of Electronic Materials Materials EngineeringMaterials ScienceElectrical EngineeringEngineeringAdvanced Packaging (Semiconductors)	2010	77
3D SiP with Organic Interposer for ASIC and Memory Integration Li Li, Pierre Chia, Paul Ton, EngineeringDevice IntegrationComputer ArchitectureHbm Dram StacksMulti-channel Memory Architecture	2016	62
Addressing bandwidth challenges in next generation high performance network systems with 3D IC integration Li Li, Peng Su, Jie Xue, EngineeringComputer ArchitectureNew GenerationInterconnection Network ArchitectureIntegrated Circuits	2012	39
The Influence of an Imposed Current on the Creep of Sn-Ag-Cu Solder Christopher Kinney, J. W. Morris, Tae-Kyu Lee, Journal of Electronic Materials Materials ScienceMaterials EngineeringEngineeringApplied PhysicsMetallurgical Interaction	2008	34
Advanced 2.5D and 3D packaging technologies for next generation Silicon Photonics in high performance networking applications Sandeep Razdan, Peter De Dobbelaere, Jie Xue, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) EngineeringDevice IntegrationIntegrated PhotonicsPackaging TechnologiesProgrammable Photonics	2022	27
Electrical performance assessment of advanced substrate technologies for high speed networking applications John Savic, Percy Aria, Judy Priest, EngineeringEnergy EfficiencyComputer ArchitectureMm Bga PackageAdvanced Substrate Technologies	2009	19
Pb-free solder joint reliability of fine pitch chip-scale packages Weidong Xie, Tae-Kyu Lee, Kuo-Chuan Liu, ReliabilityHigh Density BoardsReliability EngineeringEngineeringChip-scale Package	2010	16
Parametric acceleration transforms for lead-free solder joint reliability under thermal cycling conditions Mudasir Ahmad, Weidong Xie, Kuo-Chuan Liu, EngineeringIndustrial EngineeringPb-free SoldersMechanical EngineeringParametric Acceleration Transforms	2009	15
Effect of thermal interface materials on manufacturing and reliability of Flip Chip PBGA and SiP packages Li Li, Mohan Nagar, Jie Xue EngineeringMechanical EngineeringPower Density IncreaseRefrigerationSip Packages	2008	11
Materials Effects on Reliability of FC-PBGA Packages for Cu/low-k Chips Li Li, Jie Xue, Mudasir Ahmad, EngineeringMechanical EngineeringFlip-chip Pbga PackagesMaterials EffectsInterconnect (Integrated Circuits)	2006	11

Page 1