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3D SiP with Organic Interposer for ASIC and Memory Integration
Li Li, Pierre Chia, Paul Ton et al. · 2016 · 64 citations
Engineering, Computer Engineering, Electrical Engineering +17
Reliability Challenges in 2.5D and 3D IC Integration
Li Li, Paul Ton, Mohan Nagar et al. · 2017 · 31 citations
Engineering, Computer Engineering, Electrical Engineering +17
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