Concepedia

F. Hua

FH

Statistics

Publications

9

Citations

306

H-Index

9

Active since

2002

Affiliations

Intel (United States)(Current)

Intel (United Kingdom)

University of California, Berkeley

Hewlett-Packard (United States)

Lawrence Berkeley National Laboratory

F. Hua is an author at Intel (United States) specializing in materials engineering, metals, and materials science.

Publications per year

2002–2010

9

Publications

9

The creep properties of lead-free solder joints

Hongxin Song, J. W. Morris, F. Hua · JOM · 2002 · 101 citations

, , +12

Eutectic Sn-Bi as an alternative to Pb-free solders

F. Hua, Zequn Mei, J. Glazer · 2002 · 73 citations

, , +16

Creep properties of Sn-rich solder joints

J. W. Morris, Hongxin Song, F. Hua · 2004 · 36 citations

, , +12

Low temperature soldering

Z. Mei, F. Hua, J. Glazer et al. · 2002 · 24 citations

, , +14

Effect of cooling rate on microstructure and shear strength of pure Sn, Sn-0.7Cu, Sn-3.5Ag, and Sn-37Pb solders

J.G. Maveety, Plin Liu, Jayamalar Vijayen et al. · Journal of Electronic Materials · 2004 · 22 citations

, , +15

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