J.G. Maveety - Concepedia

Author

J.G. Maveety

Intel (United States)

Also Known As

J. G. Maveety, J. Maveety, J.G Maveety, J.G. Maveety, Jim Maveety

Publications

703

Citations

H-Index

Concepts

All Affiliations

Intel (United States)Stanford University Mission College University of New Mexico

About

J.G. Maveety is an author at Intel (United States) specializing in engineering, thermal engineering, and heat transfer.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	12	12	664
2	Computer Engineering	6	6	496
3	Electrical Engineering	4	4	432
4	Applied Physics	1	1	21
5	Materials Engineering	1	1	21

J.G. Maveety

Publications

686

Citations

H-Index

Page 1

	Year	Citations
Closed-loop electroosmotic microchannel cooling system for VLSI circuits Linan Jiang, J. C. Mikkelsen, Jae-Mo Koo, IEEE Transactions on Components and Packaging Technologies Low Thermal ResistanceElectrical EngineeringWorking FluidEngineeringLiquid Metal Cooling	2002	236
Micromachined Jets for Liquid Impingement Cooling of VLSI Chips E.N. Wang, L. Zhang, Linan Jiang, Journal of Microelectromechanical Systems EngineeringLiquid Metal CoolingRefrigerationHeat Transfer ProcessMicrojet Heat Sinks	2004	155
Design of an optimal pin-fin heat sink with air impingement cooling J.G. Maveety, Hoon Hyung Jung International Communications in Heat and Mass Transfer EngineeringLiquid Metal CoolingHeat ExchangerHeat Transfer EnhancementMechanical Engineering	2000	62
Heat transfer from square pin-fin heat sinks using air impingement cooling J.G. Maveety, Hoon Hyung Jung IEEE Transactions on Components and Packaging Technologies Heat Transfer ProcessEngineeringHeat SinkHeat Sink GeometriesHeat Sink Geometry	2002	35
A Heat Sink Performance Study Considering Material, Geometry, Nozzle Placement, and Reynolds Number With Air Impingement J.G. Maveety, J. F. Hendricks Journal of Electronic Packaging EngineeringFluid MechanicsMechanical EngineeringReynolds NumberNozzle Placement	1999	34
Cross-Linked Microchannels for VLSI Hotspot Cooling Linan Jiang, Jae-Mo Koo, Evelyn N. Wang, EngineeringLiquid Metal CoolingHeat PipeRefrigerationAdvanced Packaging (Semiconductors)	2002	29
Two-phase microchannel heat sinks for an electrokinetic VLSI chip cooling system Linan Jiang, Jae-Mo Koo, Shulin Zeng, EngineeringLiquid Metal CoolingHeat PipeRefrigerationAluminum Fin Array	2002	29
Micromachined Jet Arrays for Liquid Impingement Cooling of VLSI Chips E.N. Wang, L. Zhang, Linan Jiang,	2002	22
Effect of cooling rate on microstructure and shear strength of pure Sn, Sn-0.7Cu, Sn-3.5Ag, and Sn-37Pb solders J.G. Maveety, Plin Liu, Jayamalar Vijayen, Journal of Electronic Materials Materials EngineeringMaterials ScienceEngineeringMechanical EngineeringApplied Physics	2004	21
A two-dimensional numerical investigation of the optimal removal time and entropy production rate for a sensible thermal storage system J.G. Maveety, A. Razani Energy EngineeringOptimal Removal TimeEnergy EfficiencyEnergy ManagementEntropy Production Rate	1996	20

Page 1