Concepedia

Zequn Mei

ZM

6

Publications

235

Citations

6

H-Index

1996

Active since

Affiliations

Hewlett-Packard (United States)(Current)

Zequn Mei is an author at Hewlett-Packard (United States) specializing in materials science, electronic packaging, and microstructure.

Top concepts

EngineeringMicrostructureMaterial ScienceElectronic PackagingCorrosionMaterials EngineeringMechanical EngineeringElectrical EngineeringThermodynamicsApplied Physics

Publications per year

1996–2006

6

Publications

6

Brittle interfacial fracture of PBGA packages soldered on electroless nickel/immersion gold

Zequn Mei, Marvin Kaufmann, A. Eslambolchi et al. · 2002 · 92 citations

Engineering, Mechanical Engineering, Brittle Interfacial Fracture +17

Eutectic Sn-Bi as an alternative to Pb-free solders

F. Hua, Zequn Mei, J. Glazer · 2002 · 73 citations

Materials Engineering, Materials Science, Electrical Engineering +13

Effect of electroless Ni/immersion Au plating parameters on PBGA solder joint attachment reliability

Zequn Mei, Peter M. Johnson, Marvin Kaufmann et al. · 2003 · 24 citations

Engineering, Mechanical Engineering, Chemical Engineering +18

Microstructure and Thermal Fatigue Life of BGAs with Eutectic Sn-Ag-Cu Balls Assembled at 210~C with Eutectic Sn-Pb Solder Paste

B Nandagopal, Zequn Mei, Sue Teng · 2006 · 18 citations

Solid Phase, Engineering, Complete Mixing +19

A Thermal Fatigue Failure Mechanism of 58Bi-42Sn Solder Joints

Zequn Mei, Helen Holder · Journal of Electronic Packaging · 1996 · 17 citations

Materials Science, Solder Joint, Engineering +14

Rows per page

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