Zequn Mei - Concepedia

Author

Zequn Mei

Also Known As

Zequn Mei

Publications

260

Citations

H-Index

Concepts

All Affiliations

Zequn Mei is an author at Hewlett-Packard (United States) specializing in materials science, electronic packaging, and microstructure.

#	Concept	H-Index	Publications	Citations
1	Engineering	5	5	224
2	Materials Engineering	4	4	207
3	Electrical Engineering	3	3	189
4	Applied Physics	2	2	110
5	Chemical Engineering	1	1	24

Zequn Mei

Publications

235

Citations

H-Index

Page 1

	Year	Citations
Brittle interfacial fracture of PBGA packages soldered on electroless nickel/immersion gold Zequn Mei, Marvin Kaufmann, A. Eslambolchi, EngineeringMechanical EngineeringBrittle Interfacial FracturePbga PackagesElectroless Nickel/immersion Gold	2002	92
Eutectic Sn-Bi as an alternative to Pb-free solders F. Hua, Zequn Mei, J. Glazer Materials EngineeringMaterials ScienceElectrical EngineeringEngineeringSuperalloy	2002	73
Effect of electroless Ni/immersion Au plating parameters on PBGA solder joint attachment reliability Zequn Mei, Peter M. Johnson, Marvin Kaufmann, EngineeringMechanical EngineeringChemical EngineeringAdvanced Packaging (Semiconductors)Material Processing	2003	24
Microstructure and Thermal Fatigue Life of BGAs with Eutectic Sn-Ag-Cu Balls Assembled at 210~C with Eutectic Sn-Pb Solder Paste B Nandagopal, Zequn Mei, Sue Teng Solid PhaseEngineeringComplete MixingCorrosionThermal Analysis	2006	18
A Thermal Fatigue Failure Mechanism of 58Bi-42Sn Solder Joints Zequn Mei, Helen Holder Journal of Electronic Packaging Materials ScienceSolder JointEngineeringHardware ReliabilityPhysic Of Failure	1996	17
Evaluation of Ni/Pd/Au as an alternative metal finish on PCB Zequn Mei, A. Eslambolchi Circuit World	1999	11

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