A. Eslambolchi

Publications

127

Citations

H-Index

1999

Active since

Affiliations

Hewlett-Packard (United States)(Current)

A. Eslambolchi is an author at Hewlett-Packard (United States) specializing in materials engineering, electronic packaging, and mechanical engineering.

Top concepts

CorrosionEngineeringMicrostructureMaterial ScienceMicroelectronicsElectronic PackagingMaterials EngineeringElectrical EngineeringMechanical EngineeringApplied Physics

Publications per year

1999–2003

Publications

Brittle interfacial fracture of PBGA packages soldered on electroless nickel/immersion gold

Zequn Mei, Marvin Kaufmann, A. Eslambolchi et al. · 2002 · 92 citations

Engineering, Mechanical Engineering, Brittle Interfacial Fracture +17

Effect of electroless Ni/immersion Au plating parameters on PBGA solder joint attachment reliability

Zequn Mei, Peter M. Johnson, Marvin Kaufmann et al. · 2003 · 24 citations

Engineering, Mechanical Engineering, Chemical Engineering +18

Evaluation of Ni/Pd/Au as an alternative metal finish on PCB

Zequn Mei, A. Eslambolchi · Circuit World · 1999 · 11 citations

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