Publication | Closed Access
Effect of cooling rate on microstructure and shear strength of pure Sn, Sn-0.7Cu, Sn-3.5Ag, and Sn-37Pb solders
21
Citations
4
References
2004
Year
Materials EngineeringMaterials ScienceEngineeringMechanical EngineeringApplied PhysicsCold WorkingSn-37pb SoldersHot WorkingElectronic PackagingShear StrengthPure SnMicrostructure
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