Journal of Electronic Materials · 2014 · 15 citations · 11 references
EngineeringMaterials EngineeringMaterials ScienceMechanical Behavior Of MaterialsMicroelectromechanical SystemsMicrofabricationMems DesignMems FabricationMems MaterialsMems PackagingPackaging EngineeringPackaging MaterialsHermetic PackagingHermetic SealingMems Device PackagingPackage SealingPackage Sealing TechnologyPackaging SealsSensor Packaging
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Transport of vacuum arc plasma through an off-plane double bend filtering duct
Xiaopeng Shi, Beng Kang Tay, H.S. Tan et al. · Thin Solid Films · 1999 · 72 citations
Low temperature interdiffusion in Au/In thin film couples
J. Bjøntegaard, L. Buene, T. G. Finstad et al. · Thin Solid Films · 1983 · 45 citations
Natural Sciences, Materials Engineering, Materials Science +13