Concepedia

Package Sealing

Package Sealing is an ultrasonic welding technique that belongs to the class of hermetic enclosure methods, distinguished by its use of high-frequency vibrational energy to fuse thermoplastic materials in a controlled manner, thereby creating airtight and liquid-tight joints in packaging applications.

17

Publications

380

Citations

60

Authors

38

Institutions

Publications per year

2017–2026

2

Parents

Publications

17

Ultrasonic Bonding for MEMS Sealing and Packaging

Jongbaeg Kim, Bongwon Jeong, Mu Chiao et al. · IEEE Transactions on Advanced Packaging · 2009 · 69 citations

, , +17

Study on failure mechanism and sealing performance optimization of compression packer

Liqin Qian, Jiayan Zou, Chengyu Xia et al. · Engineering Failure Analysis · 2022 · 42 citations

, , +8

Durability of Dye-Sensitized Solar Cells and Modules

Takayuki Kitamura, Kenichi Okada, Hiroshi Matsui et al. · Journal of Solar Energy Engineering · 2010 · 37 citations

, , +17

Glass Frit as a Hermetic Joining Layer in Laser Based Joining of Miniature Devices

Qiang Wu, Norbert Lorenz, Kevin M. Cannon et al. · IEEE Transactions on Components and Packaging Technologies · 2010 · 34 citations · Full text

, , +17

Analysis of packaging and sealing techniques for microelectronic modules and recent advances

P. K. Khanna, S. K. Bhatnagar, W. Gust · Microelectronics International · 1999 · 24 citations

, , +15

1–5 of 17

Authors

60

  1. DP
    Duncan P. Hand

    Heriot-Watt University, United Kingdom

    2 publications · 52 citations

    2

    h-index

  2. LQ
    Liqin Qian

    Yangtze University, China

    1 publications · 42 citations

    1

    h-index

  3. GS
    Göran Stemme

    KTH Royal Institute of Technology, Sweden

    1 publications · 18 citations

    1

    h-index

  4. WG
    W. Gust

    Max Planck Society, Germany

    1 publications · 24 citations

    1

    h-index

  5. NL
    Norbert Lorenz

    Anstalt für Verbrennungskraftmaschinen List (Austria), Austria

    1 publications · 34 citations

    1

    h-index

1–5 of 60

Institutions

38

  1. Heriot-Watt University

    Edinburgh, United Kingdom

    2 h-index

    6 publications

    140 citations

  2. University of Illinois Urbana-Champaign

    Urbana, United States

    1 h-index

    3 publications

    54 citations

  3. Nanyang Technological University

    Singapore, Singapore

    1 h-index

    1 publications

    15 citations

  4. Liberty Mutual Research Institute for Safety

    Hopkinton, United States

    1 h-index

    3 publications

    39 citations

  5. Yangtze University

    Jingzhou, China

    1 h-index

    3 publications

    126 citations

  6. KTH Royal Institute of Technology

    Stockholm, Sweden

    1 h-index

    3 publications

    54 citations

  7. Medical Research Council

    London, United Kingdom

    1 h-index

    1 publications

    16 citations

  8. Commissariat à l'Énergie Atomique et aux Énergies Alternatives

    Paris, France

    1 h-index

    5 publications

    65 citations

1–8 of 38

Venues

  1. Journal of Micromechanics and Microengineering

    JMM · 2 publications · 36 citations

    2

    h-index

  2. Journal of Electronic Materials

    JEM · 1 publications · 15 citations

    1

    h-index

  3. 1

    h-index

  4. Medical & Biological Engineering & Computing

    1 publications · 16 citations

    1

    h-index

  5. Packaging Technology and Science

    1 publications · 18 citations

    1

    h-index

1–5