Analysis of packaging and sealing techniques for microelectronic modules and recent advances

Abstract

A critical analysis of packaging and sealing methods for integrated circuits, hybrid microcircuits and multichip modules has been done. The best hermetic and high yield weld seal is examined along with other conventional seals like solder seal, frit seal and plastic seal with special emphasis on materials and processes involved in each case. An overview of emerging technology is also presented. A comparative analysis is made for selection of the right technology and material for a particular requirement.