Packaging Techniques

Packaging Techniques is an engineering methodology that encompasses the physical integration, interconnection, and thermal management strategies of power electronic components in electric vehicle systems to optimize performance, reliability, and compactness.

406

Publications

16.7K

Citations

1.5K

Authors

388

Institutions

Publications per year

2017–2026

86

Authors

1.5K

  1. GL
    Guo‐Quan Lu

    Virginia Tech, United States

    9 publications · 276 citations

    9

    h-index

  2. ZL
    Zhenxian Liang

    Oak Ridge National Laboratory, United States

    4 publications · 89 citations

    4

    h-index

  3. SH
    S. Haque

    Virginia Tech, United States

    4 publications · 73 citations

    4

    h-index

  4. DC
    Douglas C. Hopkins

    North Carolina State University, United States

    4 publications · 78 citations

    4

    h-index

  5. RF
    R.A. Fillion

    General Electric (United States), United States

    3 publications · 106 citations

    3

    h-index

1–5 of 1.5K

Venues

  1. Microelectronics Reliability

    15 publications · 626 citations

    14

    h-index

  2. 11

    h-index

  3. Journal of Electronic Packaging

    9 publications · 624 citations

    9

    h-index

  4. IEEE Transactions on Power Electronics

    8 publications · 360 citations

    8

    h-index

  5. 6

    h-index

1–5