Packaging Techniques
Packaging Techniques is an engineering methodology that encompasses the physical integration, interconnection, and thermal management strategies of power electronic components in electric vehicle systems to optimize performance, reliability, and compactness.
406
Publications
16.7K
Citations
1.5K
Authors
388
Institutions
Publications per year
2017–2026
86
406
Micromachined inertial sensors
N. Yazdi, Farrokh Ayazi, K. Najafi · Proceedings of the IEEE · 1998 · 1.8K citations
Engineering, Electrical Engineering, Mechanical Engineering +17
The Wiley encyclopedia of packaging technology
Choice Reviews Online · 1997 · 557 citations
Principles of Electronic Packaging
D. P. Seraphim, Ronald C. Lasky, Che‐Yu Li et al. · Journal of Electronic Packaging · 1989 · 354 citations
1–5 of 406
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388
Virginia Tech
Blacksburg, United States
11 h-index
44 publications
1.2K citations
Georgia Institute of Technology
Atlanta, United States
8 h-index
25 publications
743 citations
IBM (United States)
Armonk, United States
7 h-index
10 publications
298 citations
Fraunhofer Institute for Reliability and Microintegration
Berlin, Germany
6 h-index
21 publications
504 citations

Chinese Academy of Sciences
Beijing, China
6 h-index
28 publications
1.5K citations

Delft University of Technology
Delft, The Netherlands
6 h-index
13 publications
902 citations
Intel (United States)
Santa Clara, United States
6 h-index
14 publications
490 citations
Technische Universität Berlin
Berlin, Germany
5 h-index
8 publications
721 citations
1–8 of 388
15 publications · 626 citations
14
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11 publications · 437 citations
11
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9 publications · 624 citations
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8 publications · 360 citations
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6 publications · 131 citations
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