Concepedia

R.A. Fillion

RF

Statistics

Publications

11

Citations

314

H-Index

10

Active since

1990

Affiliations

General Electric (United States)(Current)

GE Global Research (United States)

R.A. Fillion is an author at General Electric (United States) specializing in engineering, electrical engineering, and chip packaging.

Publications per year

1990–2005

11

Publications

11

High frequency, low cost, power packaging using thin film power overlay technology

R. M. Fisher, R.A. Fillion, James Burgess et al. · 1995 · 70 citations

Engineering, Computer Engineering, Electrical Engineering +17

Overlay high-density interconnect: a chips-first multichip module technology

Wolfgang Daum, W.E. Burdick, R.A. Fillion · Computer · 1993 · 59 citations

Engineering, Computer Engineering, Electrical Engineering +17

Development of a plastic encapsulated multichip technology for high volume, low cost commercial electronics

R.A. Fillion, R.J. Wojnarowski, T.B. Gorcyzca et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1995 · 36 citations

Engineering, Materials Engineering, Materials Science +17

An overview of thermal management for next generation microelectronic devices

Sandeep Tonapi, R.A. Fillion, Florian Johannes Schattenmann et al. · 2003 · 34 citations

Engineering, Aerospace Engineering, Electrical Engineering +17

A silicon-carbide micro-capillary pumped loop for cooling high power devices

L. Meyer, Samhita Dasgupta, David Shaddock et al. · 2003 · 22 citations

Engineering, Electrical Engineering, Materials Engineering +17

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