David Shaddock

Printed electronics for extreme high temperature environments

Mohammed Alhendi, Firas Alshatnawi, El Mehdi Abbara et al. · Additive manufacturing · 2022 · 58 citations · Full text

Engineering, Materials Engineering, Materials Science +10

Microstructure Evolution and the Constitutive Relations of High-Temperature Solders

Harry Schoeller, Shubhra Bansal, Aaron Knobloch et al. · Journal of Electronic Materials · 2009 · 40 citations

Natural Sciences, Materials Engineering, Materials Science +16

A silicon-carbide micro-capillary pumped loop for cooling high power devices

L. Meyer, Samhita Dasgupta, David Shaddock et al. · 2003 · 22 citations

Engineering, Electrical Engineering, Materials Engineering +17

Lead-free Solder Joint Reliability – State of the Art and Perspectives

Jianbiao Pan, Jyhwen Wang, David Shaddock · Journal of Microelectronics and Electronic Packaging · 2005 · 20 citations

Natural Sciences, Materials Engineering, Materials Science +12

Effect of alloying elements on the creep behavior of high Pb-based solders

Harry Schoeller, Shubhra Bansal, Aaron Knobloch et al. · Materials Science and Engineering A · 2010 · 19 citations

Natural Sciences, Materials Engineering, Materials Science +14