Concepedia

Package Sealing Technology

Package Sealing Technology is a sterile packaging methodology that establishes and maintains a hermetic barrier through the application of controlled physical or chemical processes to fuse package materials, thereby ensuring microbial ingress prevention and product sterility maintenance throughout the shelf life.

12

Publications

301

Citations

47

Authors

24

Institutions

Publications per year

2017–2026

1

Parents

Publications

12

A Low-Temperature Thin-Film Electroplated Metal Vacuum Package

B.H. Stark, K. Najafi · Journal of Microelectromechanical Systems · 2004 · 101 citations

, , +17

Durability of Dye-Sensitized Solar Cells and Modules

Takayuki Kitamura, Kenichi Okada, Hiroshi Matsui et al. · Journal of Solar Energy Engineering · 2010 · 37 citations

, , +17

A New Silicone Gel Sealing Mechanism for High Reliability Encapsulation

K. Otsuka, Y. Shirai, Katsunobu Okutani · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1984 · 29 citations

, , +17

Analysis of packaging and sealing techniques for microelectronic modules and recent advances

P. K. Khanna, S. K. Bhatnagar, W. Gust · Microelectronics International · 1999 · 24 citations

, , +15

Small footprint wafer-level vacuum packaging using compressible gold sealing rings

Mikael Antelius, Göran Stemme, Frank Niklaus · Journal of Micromechanics and Microengineering · 2011 · 18 citations

, , +17

1–5 of 12

Authors

47

  1. GS
    Göran Stemme

    KTH Royal Institute of Technology, Sweden

    1 publications · 18 citations

    1

    h-index

  2. KN
    K. Najafi

    University of Michigan, United States

    1 publications · 101 citations

    1

    h-index

  3. WG
    W. Gust

    Max Planck Society, Germany

    1 publications · 24 citations

    1

    h-index

  4. DD
    Dana DeReus

    Essex Westford School District, United States

    1 publications · 14 citations

    1

    h-index

  5. MA
    Mikael Antelius

    KTH Royal Institute of Technology, Sweden

    1 publications · 18 citations

    1

    h-index

1–5 of 47

Institutions

24

  1. University of Arkansas at Fayetteville

    Fayetteville, United States

    1 h-index

    3 publications

    42 citations

  2. Rensselaer Polytechnic Institute

    Troy, United States

    1 h-index

    2 publications

    22 citations

  3. Nanyang Technological University

    Singapore, Singapore

    1 h-index

    1 publications

    15 citations

  4. Liberty Mutual Research Institute for Safety

    Hopkinton, United States

    1 h-index

    3 publications

    39 citations

  5. KTH Royal Institute of Technology

    Stockholm, Sweden

    1 h-index

    3 publications

    54 citations

  6. Lamar University

    Beaumont, United States

    1 h-index

    1 publications

    15 citations

  7. Changzhou Institute of Technology

    Changzhou, China

    1 h-index

    4 publications

    60 citations

  8. Central Electronics Engineering Research Institute

    Pilāni, India

    1 h-index

    2 publications

    48 citations

1–8 of 24

Venues

  1. 2

    h-index

  2. Journal of Electronic Materials

    JEM · 1 publications · 15 citations

    1

    h-index

  3. IEEE Transactions on Advanced Packaging

    1 publications · 14 citations

    1

    h-index

  4. 1

    h-index

  5. Journal of the European Ceramic Society

    1 publications · 14 citations

    1

    h-index

1–5