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A New Silicone Gel Sealing Mechanism for High Reliability Encapsulation
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1984
Year
EngineeringDevice IntegrationConventional PlasticBiomedical EngineeringHardware SecurityAdvanced Packaging (Semiconductors)High Reliability EncapsulationElectronic PackagingSealing MechanismCeramic PackagesMaterials ScienceChip On BoardSealantComputer EngineeringMicro-encapsulationChip AttachmentMicroelectronicsPackage Integration3D PrintingAdvanced PackagingChip-scale PackageFlexible ElectronicsMicrofabrication
Plastic molded packages for large-scale integrated (LSI) devices are widely utilized for low-cost computer equipment. The environmental reliability of conventional plastic molded packages, however, is inferior to the reliability of hermetically sealed ceramic packages. A sealing mechanism for the chip, using a silicone jelly as an encapsulation, is discussed.