7
Publications
266
Citations
7
H-Index
2009
Active since
Affiliations
Bongwon Jeong is an author at University of Illinois Urbana-Champaign specializing in engineering, mechanical engineering, and microfabrication.
Top concepts
EngineeringMicrofabricationMechanical EngineeringApplied PhysicsMaterial ScienceMicroelectronicsVibration ControlMechanical SystemsMechanicsNanomechanics
Publications per year
2009–2017
7
7
Ultrasonic Bonding for MEMS Sealing and Packaging
Jongbaeg Kim, Bongwon Jeong, Mu Chiao et al. · IEEE Transactions on Advanced Packaging · 2009 · 67 citations
Hanna Cho, Bongwon Jeong, Min-Feng Yu et al. · International Journal of Solids and Structures · 2012 · 65 citations
Modeling and Measurement of Geometrically Nonlinear Damping in a Microcantilever–Nanotube System
Bongwon Jeong, Hanna Cho, Min-Feng Yu et al. · ACS Nano · 2013 · 37 citations
Development of MEMS Multi-Mode Electrostatic Energy Harvester Based on the SOI Process
Bongwon Jeong, Min‐Ook Kim, Jae-Ik Lee et al. · Micromachines · 2017 · 21 citations · Full text
Rows per page
1–5 of 7