Ultra-high vacuum direct bonding of a p–n junction GaAs wafer using low-energy hydrogen ion beam surface cleaning

SEMICONDUCTOR WAFER BONDING

U. Gösele, Qiaoling Tong · Annual Review of Materials Science · 1998 · 594 citations

Engineering, Materials Engineering, Materials Science +17

Experimental analysis and theoretical model for anomalously high ideality factors (n≫2.0) in AlGaN/GaN <i>p-n</i> junction diodes

Jay Shah, Y.-L. Li, Th. Gessmann et al. · Journal of Applied Physics · 2003 · 464 citations

Engineering, Electrical Engineering, Materials Science +17

Wafer direct bonding: tailoring adhesion between brittle materials

A. Plößl · Materials Science and Engineering R Reports · 1999 · 350 citations

Engineering, Materials Engineering, Materials Science +11

Solid state electronic devices

G.W.A.D. · Microelectronics Reliability · 1973 · 316 citations

Engineering, Electrical Engineering, Physics +13

Wafer fusion: materials issues and device results

A. Black, Aaron R. Hawkins, N.M. Margalit et al. · IEEE Journal of Selected Topics in Quantum Electronics · 1997 · 143 citations

Engineering, Materials Engineering, Materials Science +13