Publication | Closed Access
Wafer direct bonding: tailoring adhesion between brittle materials
344
Citations
150
References
1999
Year
Materials ScienceMaterials EngineeringWafer Scale ProcessingEngineeringAdhesive MaterialWafer Direct BondingElectronic PackagingStructural Adhesive
| Year | Citations | |
|---|---|---|
Page 1
Page 1